GENEVA, July 18 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (EP2025/050290) for “MULTI-MODE LAYER FOR CSI TOKENIZATION”. With publication no. WO/2026/149636, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G06N 3/045
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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