International Patent: MULTI-LEVEL ALIGNMENT SYSTEM FOR HIGH-DENSITY OPTICAL INTERCONNECTS

GENEVA, Oct. 1 -- MELLANOX TECHNOLOGIES, LTD. filed a patent application (IL2026/050235) for “MULTI-LEVEL ALIGNMENT SYSTEM FOR HIGH-DENSITY OPTICAL INTERCONNECTS”. With publication no. WO/2026/190792, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G02B 6/42

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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