GENEVA, Sept. 7 -- QUALCOMM INCORPORATED filed a patent application (US2026/011411) for “MULTI-DIMENSIONAL CONSTELLATIONS WITH LOW PEAK-TO-AVERAGE POWER RATIO”. With publication no. WO/2026/182835, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H04L 27/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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