International Patent: MULTI-DIE SEMICONDUCTOR DEVICE WITH INTERFACE OR CONTROL INTERCONNECTIONS

GENEVA, July 18 -- QUALCOMM INCORPORATED filed a patent application (US2025/059320) for “MULTI-DIE SEMICONDUCTOR DEVICE WITH INTERFACE OR CONTROL INTERCONNECTIONS”. With publication no. WO/2026/151564, here are the other details related to the patent application:

Kind: Initial Publication without ISR [A2]

IPC: H10W 90/22

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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