International Patent: MOLD KIT, SELF-PIERCING ENGAGEMENT METHOD, BATTERY TERMINAL CONTACT ASSEMBLY, AND BATTERY

GENEVA, June 24 -- SHANGHAI EMHART FASTENING SYSTEM CO., LTD. filed a patent application (CN2025/137998) for “MOLD KIT, SELF-PIERCING ENGAGEMENT METHOD, BATTERY TERMINAL CONTACT ASSEMBLY, AND BATTERY”. With publication no. WO/2026/114295, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01M 50/553

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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