GENEVA, Oct. 5 -- MITSUBISHI ELECTRIC CORPORATION filed a patent application (JP2026/010927) for “MOLD DEVELOPMENT ESTIMATION DEVICE, MOLD SUPPRESSION ASSISTANCE SYSTEM, MOLD DEVELOPMENT ESTIMATION METHOD, AND PROGRAM”. With publication no. WO/2026/204730, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: F24F 11/64
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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