International Patent: MOF SHAPING USING 2 OR 3 PHASE TECHNOLOGY

GENEVA, Aug. 31 -- CSP TECHNOLOGIES, INC. filed a patent application (US2026/015588) for “MOF SHAPING USING 2 OR 3 PHASE TECHNOLOGY”. With publication no. WO/2026/178069, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B01J 20/22

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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