International Patent: MODULAR SYSTEM FOR HOUSINGS OF ELECTRONIC COMPONENTS

GENEVA, June 24 -- RIEGEL, Jürgen filed a patent application (EP2025/081522) for “MODULAR SYSTEM FOR HOUSINGS OF ELECTRONIC COMPONENTS”. With publication no. WO/2026/114603, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05K 5/10

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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