INTERNATIONAL PATENT: MITSUBISHI MATERIALS CORPORATION, 三菱マテリアル株式会社 FILES APPLICATION FOR "COPPER MATERIAL AND INSULATING SUBSTRATE"

GENEVA, May 11 -- MITSUBISHI MATERIALS CORPORATION (2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo1008117), 三菱マテリアル株式会社 (東京都千代田区丸の内三丁目２番３号) filed a patent application (PCT/JP2025/038348) for "COPPER MATERIAL AND INSULATING SUBSTRATE" on Oct 31, 2025. With publication no. WO/2026/095043, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s):...