GENEVA, May 19 -- MITSUBISHI HEAVY INDUSTRIES, LTD. (2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo1008332), 三菱重工業株式会社 (東京都千代田区丸の内三丁目２番３号), AKITA UNIVERSITY (1-1, Tegata Gakuen-Machi, Akita-shi, Akita0108502), 国立大学法人秋田大学 (秋田県秋田市手形学園町１番１号) filed a patent application (PCT/JP2025/035809) for "FUSION BONDING METHOD" on Oct 09, 2025. With publication no. WO/2026/100287, the details related to the pa...