INTERNATIONAL PATENT: MICROCHIP TECHNOLOGY INCORPORATED FILES APPLICATION FOR "TRANSISTOR DEVICE INCLUDING ENCLOSED VOIDS BELOW A CHANNEL REGION AND METHODS OF FORMING"

GENEVA, March 3 -- MICROCHIP TECHNOLOGY INCORPORATED (2355 West Chandler Blvd.Chandler, Arizona 85224-6199) filed a patent application (PCT/US2025/016270) for "TRANSISTOR DEVICE INCLUDING ENCLOSED VOIDS BELOW A CHANNEL REGION AND METHODS OF FORMING" on Feb 18, 2025. With publication no. WO/2026/043513, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NAGEL, Steve (1201 E. Springfield Pl.Chandler, Arizona 85286), CHEN, Bomy (36463 Dijon DriveNewark, California 94560)

Abstract: A method includes forming a semiconductor laye...