GENEVA, June 24 -- CORNING INCORPORATED filed a patent application (US2025/055509) for “METHOD OF TRANSFERRING REDISTRIBUTION LAYERS FROM CARRIER SUBSTRATE TO CAVITY OF GLASS SUBSTRATE TO IMPROVE UNIFORMITY OF REDISTRIBUTION LAYERS”. With publication no. WO/2026/117382, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 90/20
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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