GENEVA, Nov. 6 -- BEIJING FRP INSTITUTE (TENGZHOU) COMPOSITE MATERIALS CO., LTD filed a patent application (CN2025/095106) for “METHOD FOR SIMULATING TEMPERATURE FIELD AND CURING DEFORMATION OF MOLD BY MEANS OF FINITE ELEMENT SIMULATION, AND MOLD OPTIMIZATION DESIGN METHOD BASED THEREON”. With publication no. WO/2026/227524, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G06F 30/23
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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