GENEVA, Oct. 5 -- FUJIFILM CORPORATION filed a patent application (JP2026/009877) for “METHOD FOR PRODUCING COMPOSITE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, RESIN COMPOSITION FOR FORMING INSULATING PART, AND PHOTOSENSITIVE RESIN COMPOSITION”. With publication no. WO/2026/204458, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G03F 7/027
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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