International Patent: METHOD FOR PRODUCING A COPPER FOIL BY ELECTROLYTIC DEPOSITON OF COPPER, COPPER FOIL, ELECTROLYTE SOLUTION

GENEVA, Oct. 30 -- ATOTECH DEUTSCHLAND GMBH & CO. KG filed a patent application (EP2026/061292) for “METHOD FOR PRODUCING A COPPER FOIL BY ELECTROLYTIC DEPOSITON OF COPPER, COPPER FOIL, ELECTROLYTE SOLUTION”. With publication no. WO/2026/224119, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C25D 1/04

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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