International Patent: METHOD FOR PERFORMING EFFECTIVE, LOW-POWER COLD WELD JOINING IN ULTRA-HIGH VACUUM FOR IN-SPACE/EXTRATERRESTRIAL MANUFACTURING APPLICATIONS

GENEVA, Sept. 18 -- OHIO STATE INNOVATION FOUNDATION filed a patent application (US2026/018046) for “METHOD FOR PERFORMING EFFECTIVE, LOW-POWER COLD WELD JOINING IN ULTRA-HIGH VACUUM FOR IN-SPACE/EXTRATERRESTRIAL MANUFACTURING APPLICATIONS”. With publication no. WO/2026/188119, here are the other details related to the patent application:

Kind: Initial Publication without ISR [A2]

IPC: none

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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