GENEVA, July 6 -- SPINWIDE CO., LTD. filed a patent application (KR2024/021157) for “METHOD FOR MANUFACTURING ULTRA-THIN COPPER FOIL STRUCTURE LAMINATED WITH INSULATING SHEET, AND METHOD FOR FORMING MULTILAYER STRUCTURE”. With publication no. WO/2026/141734, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H05K 3/06
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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