GENEVA, Oct. 5 -- WUXI SHENNAN CIRCUITS CO., LTD. filed a patent application (CN2025/138462) for “METHOD FOR MANUFACTURING SUBSTRATE FRAME LAYER, PACKAGE SUBSTRATE, AND PRODUCT”. With publication no. WO/2026/200000, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 70/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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