GENEVA, July 9 -- ATI JAPAN CORP. filed a patent application (JP2024/046507) for “METHOD FOR MANUFACTURING SILICON SUBSTRATE HAVING SILICON OXIDE FILM”. With publication no. WO/2026/146557, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/3065
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....