International Patent: METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, DEVICE FOR CLEANING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE

GENEVA, Aug. 31 -- TAICA CORPORATION filed a patent application (JP2025/034001) for “METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, DEVICE FOR CLEANING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE”. With publication no. WO/2026/176689, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01L 21/60

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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