GENEVA, July 27 -- NITTO DENKO CORPORATION filed a patent application (JP2025/044878) for “METHOD FOR MANUFACTURING RESIN MOLDED BODY, RESIN MOLDED BODY, AND LIGHT SHIELDING COMPONENT”. With publication no. WO/2026/154927, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G02B 5/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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