GENEVA, Aug. 31 -- ESSEX SOLUTIONS JAPAN CO., LTD. filed a patent application (JP2025/029584) for “METHOD FOR MANUFACTURING INSULATED WIRE, METHOD FOR DETECTING DEFECT, AND SYSTEM FOR MANUFACTURING INSULATED WIRE”. With publication no. WO/2026/176679, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01B 13/16
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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