GENEVA, Oct. 9 -- SHIN-ETSU HANDOTAI CO., LTD. filed a patent application (JP2026/008571) for “METHOD FOR MANUFACTURING HETEROEPITAXIAL WAFER”. With publication no. WO/2026/211161, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10P 14/24
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....