GENEVA, June 24 -- POONGSAN CORPORATION filed a patent application (KR2025/016083) for “METHOD FOR MANUFACTURING CU-CO-NI-SI-CR-BASED COPPER ALLOY SHEET HAVING EXCELLENT STRENGTH, ELECTRICAL CONDUCTIVITY AND BENDABILITY, AND COPPER ALLOY SHEET MANUFACTURED THEREBY”. With publication no. WO/2026/116754, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C22C 9/06
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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