International Patent: METHOD FOR FORMING VIA HOLE HAVING HIGH ASPECT RATIO

GENEVA, Oct. 22 -- COATINGSOLUTION4U CO., LTD filed a patent application (KR2026/001420) for “METHOD FOR FORMING VIA HOLE HAVING HIGH ASPECT RATIO”. With publication no. WO/2026/221224, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 20/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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