GENEVA, June 26 -- RESONAC CORPORATION filed a patent application (JP2024/042864) for “METHOD FOR FORMING INSULATING RESIN FILM HAVING PATTERN, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND PHOTOSENSITIVE FILM”. With publication no. WO/2026/120726, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G03F 7/26
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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