GENEVA, Oct. 22 -- RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY filed a patent application (KR2026/003718) for “METHOD FOR ETCHING GROUP III-V MATERIALS”. With publication no. WO/2026/221268, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10P 50/24
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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