GENEVA, Aug. 21 -- RESONAC CORPORATION filed a patent application (JP2026/004876) for “METHOD FOR ESTIMATING FILLING TIME, METHOD FOR PREPARING RESIN COMPOSITION FOR UNDERFILL, AND RESIN COMPOSITION FOR UNDERFILL”. With publication no. WO/2026/172989, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 74/15
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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