GENEVA, July 31 -- RENSSELAER POLYTECHNIC INSTITUTE filed a patent application (US2026/012362) for “METHOD FOR ENHANCED ADHESION ACROSS FULLY ENCAPSULATED METAL-CERAMIC INTERFACES IN ADDITIVE MANUFACTURING PROCESSES”. With publication no. WO/2026/161703, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 40/70
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....