GENEVA, June 19 -- THE UNIVERSITY OF CHICAGO filed a patent application (US2024/050097) for “METHOD FOR CONTROLLED SPALLING OF HIGH FRACTURE TOUGHNESS MATERIALS”. With publication no. WO/2026/080057, here are the other details related to the patent application:
Kind: Later publication of international search report [A3]
IPC: H10P 95/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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