GENEVA, Sept. 24 -- TOKYO ELECTRON LIMITED filed a patent application (US2026/019706) for “METHOD AND SYSTEM OF ENDPOINT DETECTION IN ETCHING PROCESS”. With publication no. WO/2026/198644, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G03F 7/36
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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