GENEVA, Sept. 7 -- SIEMENS AKTIENGESELLSCHAFT filed a patent application (EP2026/051967) for “METHOD AND SYSTEM FOR CREATING A 3D CAD MODEL”. With publication no. WO/2026/180149, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G06F 30/10

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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