GENEVA, July 27 -- SAMSUNG ELECTRONICS CO., LTD. filed a patent application (KR2025/022897) for “METHOD AND ELECTRONIC DEVICE FOR SEAMLESS TILE BLENDING WITH LINEAR MATCHING”. With publication no. WO/2026/155431, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G06T 5/50
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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