GENEVA, Sept. 7 -- TRUMPF LASER- UND SYSTEMTECHNIK SE filed a patent application (EP2026/055106) for “METHOD AND CUTTING DEVICE FOR CUTTING A COATED SUBSTRATE WITH AN ENERGY BEAM”. With publication no. WO/2026/180502, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B23K 26/03
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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