GENEVA, July 2 -- SAMSUNG ELECTRONICS CO., LTD. filed a patent application (KR2025/001783) for “METHOD AND APPARATUS FOR TRANSMITTING AND RECEIVING SIGNAL INCLUDING PAYLOAD HEADER IN WIRELESS COMMUNICATION SYSTEM”. With publication no. WO/2025/170338, here are the other details related to the patent application:
Kind: Later publication of revised version of international search report [A9]
IPC: H04W 72/51
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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