GENEVA, Aug. 14 -- SAMSUNG ELECTRONICS CO., LTD. filed a patent application (KR2026/002048) for “METHOD AND APPARATUS FOR SUPPORTING MOBILITY ON BASIS OF LAYER 1/LAYER 2 SIGNALING BASED ON CSI-RS MEASUREMENT”. With publication no. WO/2026/168952, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H04W 36/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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