GENEVA, Oct. 1 -- SAMSUNG ELECTRONICS CO., LTD. filed a patent application (KR2026/004140) for “METHOD AND APPARATUS FOR NETWORK SLICE REPLACEMENT WITH MULTI-ACCESS DELIVERY IN A WIRELESS COMMUNICATION SYSTEM”. With publication no. WO/2026/192411, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H04W 28/086
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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