GENEVA, July 2 -- SHENZHEN TECHNOLOGY UNIVERSITY filed a patent application (CN2025/101196) for “METHOD, SYSTEM AND APPARATUS FOR MEASURING RESIDUAL SILICON THICKNESS, AND STORAGE MEDIUM”. With publication no. WO/2026/129577, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/66
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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