International Patent: METAL-ORGANIC FRAMEWORKS WITH HIGH OPEN METAL SITE DENSITY AND LARGE SURFACE AREA

GENEVA, Sept. 18 -- THE UNIVERSITY OF HONG KONG filed a patent application (CN2026/081672) for “METAL-ORGANIC FRAMEWORKS WITH HIGH OPEN METAL SITE DENSITY AND LARGE SURFACE AREA”. With publication no. WO/2026/184694, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08G 83/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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