International Patent: METAL INTERCONNECT STRUCTURE AND METHOD FOR FORMING SAME

GENEVA, July 31 -- HUA HONG SEMICONDUCTOR (WUXI) LIMITED filed a patent application (CN2025/080666) for “METAL INTERCONNECT STRUCTURE AND METHOD FOR FORMING SAME”. With publication no. WO/2026/156980, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01L 21/768

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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