GENEVA, Aug. 31 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/121257) for “MEMS LOUDSPEAKER, LOUDSPEAKER MODULE, PREPARATION METHOD FOR MEMS LOUDSPEAKER, AND ELECTRONIC DEVICE”. With publication no. WO/2026/174773, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H04R 19/02
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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