GENEVA, July 6 -- WUYI UNIVERSITY filed a patent application (CN2025/142526) for “MEMS DEVICE PACKAGING METHOD AND MEMS CHIP UNIT”. With publication no. WO/2026/138559, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B81C 1/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....