International Patent: MEMORY DEVICE INCLUDING STACKED CONDUCTIVE CONTACTS

GENEVA, July 2 -- MICRON TECHNOLOGY, INC. filed a patent application (US2025/059704) for “MEMORY DEVICE INCLUDING STACKED CONDUCTIVE CONTACTS”. With publication no. WO/2026/136270, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10B 43/50

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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