INTERNATIONAL PATENT: MEDIATEK INC. FILES APPLICATION FOR "SIGNALING DESIGNS FOR NEW MODULATION AND CODING SCHEMES IN NEXT-GENERATION WIRELESS COMMUNICATIONS"

GENEVA, April 17 -- MEDIATEK INC. (No. 1, Dusing 1st Rd., Hsinchu Science Park, Hsinchu CityTaiwan 30078) filed a patent application (PCT/CN2025/126913) for "SIGNALING DESIGNS FOR NEW MODULATION AND CODING SCHEMES IN NEXT-GENERATION WIRELESS COMMUNICATIONS" on Oct 11, 2025. With publication no. WO/2026/077438, the details related to the patent application was published on Apr 16, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HU, Shengquan (2840 Junction Ave, San JoseCalifornia 95134), CHEN, You-Wei (2840 Junction Ave, San JoseCalifornia 95134), LIU, Jianhan (2840 Junction Ave, San JoseCali...