INTERNATIONAL PATENT: MEC COMPANY LTD., メック株式会社 FILES APPLICATION FOR "ETCHING LIQUID, REPLENISHING LIQUID AND COPPER WIRING FORMING METHOD"

GENEVA, May 19 -- MEC COMPANY LTD. (3-4-1, Kuise Minamishimmachi, Amagasaki-shi, Hyogo6600822), メック株式会社 (兵庫県尼崎市杭瀬南新町三丁目４番１号) filed a patent application (PCT/JP2025/027932) for "ETCHING LIQUID, REPLENISHING LIQUID, AND COPPER WIRING FORMING METHOD" on Aug 06, 2025. With publication no. WO/2026/100155, the details related to the patent application was published on May 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KU...