International Patent: MEASUREMENT SYSTEM FOR MEASURING A THICKNESS OF A LAYER ON A SUBSTRATE, DEPOSITION APPARATUS, METHOD OF MEASURING A THICKNESS OF A LAYER ON A SUBSTRATE, AND METHOD OF CONTROLLING A THICKNESS OF A LAYER ON A SUBSTRATE

GENEVA, July 2 -- APPLIED MATERIALS, INC. filed a patent application (IB2024/062815) for “MEASUREMENT SYSTEM FOR MEASURING A THICKNESS OF A LAYER ON A SUBSTRATE, DEPOSITION APPARATUS, METHOD OF MEASURING A THICKNESS OF A LAYER ON A SUBSTRATE, AND METHOD OF CONTROLLING A THICKNESS OF A LAYER ON A SUBSTRATE”. With publication no. WO/2026/132866, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10K 71/70

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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