GENEVA, July 9 -- YANGTZE MEMORY TECHNOLOGIES CO., LTD. filed a patent application (CN2025/070142) for “MANAGING AIR GAPS IN THREE-DIMENSIONAL SEMICONDUCTOR DEVICES”. With publication no. WO/2026/143596, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10B 12/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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