International Patent: MAGNETIC HEAD DEVICE, MAGNETIC HEAD MODULE, MEMORY, ELECTRONIC DEVICE, AND PREPARATION METHOD FOR MAGNETIC HEAD DEVICE

GENEVA, July 6 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/127295) for “MAGNETIC HEAD DEVICE, MAGNETIC HEAD MODULE, MEMORY, ELECTRONIC DEVICE, AND PREPARATION METHOD FOR MAGNETIC HEAD DEVICE”. With publication no. WO/2026/138077, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G11B 5/31

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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