International Patent: MACHINE LEARNING SOLUTIONS FOR RLC SDU CONSTRUCTION IN NON-IP DATA DELIVERY TRANSMISSION OVER NON-TERRESTRIAL NETWORKS

GENEVA, Aug. 7 -- QUALCOMM INCORPORATED filed a patent application (US2026/012570) for “MACHINE LEARNING SOLUTIONS FOR RLC SDU CONSTRUCTION IN NON-IP DATA DELIVERY TRANSMISSION OVER NON-TERRESTRIAL NETWORKS”. With publication no. WO/2026/164974, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H04L 1/1607

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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