INTERNATIONAL PATENT: MACDERMID ENTHONE INC. FILES APPLICATION FOR "METASTABLE FINE GRAIN COPPER FOR HYBRID BONDING APPLICATIONS"

GENEVA, April 8 -- MACDERMID ENTHONE INC. (245 Freight StreetWaterbury, CT 06702) filed a patent application (PCT/US2025/046569) for "METASTABLE FINE GRAIN COPPER FOR HYBRID BONDING APPLICATIONS" on Sep 16, 2025. With publication no. WO/2026/072378, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YE, Pingping (71 Mesa DriveBethany, CT 06524), HAN, Jianwen (17 Revere CircleSouthbury, CT 06488), ELSAWY, Abdelhamid (46 Renchy Street1st FloorFairfield, CT 06824), BRAYE, Stephan I. (35 Claudia DriveApt. 122West Haven, CT 06516...